www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 1 of 5 s pec n o : ? ? s s p p e e c c i i f f i i c c a a t t i i o o n n customer product ? saw filter model no hdf 49 a f11 prepared checked approved ? d a t e 200 4 - 9 - 26 ??? shoulder electronics limited ?? c ustomer received: c hecked ? approved d ate
s aw filter hdf 49 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 2 of 5 ?? history record date spec . no . ?? part no . ??? customer no . modify content ? remark
s aw filter hdf 49 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 3 of 5 1. scope this specification shall cover the characteristics of saw filter with f 49 a used for the e - amps/adc. 2. electrical specification dc voltage vd c 10v ac voltage vpp 10v50hz/60hz operation temperature - 4 0 to +85 storage temperature - 45 to +85 rf power dissipation 0dbm 2.2 electronic characteristics type 3 db passband (mhz) insertion - l oss max(db) stop - band atten. min(db) loop - lo ss min(db) out - band atten. (db) impedance ( ) hd f49a 49.67~ 49.99 4 30 42 30 50/50 3. dimension
s aw filter hdf 49 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 4 of 5 4. test circuit 5 5 . . t t y y p p i i c c a a l l f f r r e e q q u u e e n n c c y y r r e e s s p p o o n n s s e e 6 . environmental characteristics 6 - 1 high temperature exposure subj ect the device to +85 for 16 hours. then release the filter into the room conditions for 24 hours prior to the measurement. it shall fulfill the specifications in 2.2 . 6 - 2 low temperature exposure
s aw filter hdf 49 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 5 of 5 subject the device to - 4 0 for 16 hours. then release t he device into the room conditions for 24 hours prior to the measurement. it shall fulfill the specifications in 2.2 . 6 - 3 temperature cycling subject the device to a low temperature of - 40 for 30 minutes. following by a high temperature of +8 5 for 30 minutes. then release the device into the room conditions for 24 hours prior to the me a surement. it shall meet the specifications in 2.2 . 6 - 4 resistance to solder heat dip the device terminals no closer than 1.5mm into the solder bath at 260 10 for 10 1 sec. then release the device into the room conditions for 4 hours. the device shall meet the specifications in 2.2 . 6 - 5 solderability subject the device terminals into the solder bath at 245 5 for 5s, more than 95% area of the terminals must be covered with new solder. it shall meet the specifications in 2.2 . 6 - 6 mechanical shock drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 2.2 . 6 - 7 vibration subject the dev ice to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. the device shall fulfill the specifications in 2.2 . 7 . remark 7 .1 static voltage static voltage between signal load & ground may cause det e riora tion &destruction of the component. please avoid static voltage. 7 .2 ultrasonic cleaning ultrasonic vibration may cause det e r ioration & destruction of the component. please avoid ultrasonic cleaning 7 .3 soldering only leads of component may be solded. please avoid soldering another part of component.
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